Title:
Manufacturing method of suspension board with circuit and suspension board with circuit
Document Type and Number:
Japanese Patent JP6294861
Kind Code:
B2
Abstract:
A suspension board with circuit includes a metal supporting board, a conductor layer, a first insulating layer disposed between the metal supporting board and the conductor layer and having a first thickness, a second insulating layer having a second thickness in a portion disposed on the first insulating layer, and a pedestal disposed on the metal supporting board. The pedestal includes a first layer prepared from the same material as that of the first insulating layer and a second layer prepared from the same material as that of the second insulating layer. The thickness of the pedestal is different from any one of the first thickness, the second thickness, and the total sum of the first thickness and the second thickness.
Inventors:
Hitoshi Fujimura
Application Number:
JP2015238852A
Publication Date:
March 14, 2018
Filing Date:
December 07, 2015
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
G11B5/60; G11B21/21; H05K1/05; H05K3/28
Domestic Patent References:
| JP2011243267A | ||||
| JP2012104210A | ||||
| JP2013200934A | ||||
| JP2001350272A |
Attorney, Agent or Firm:
Hiroyuki Okamoto
Shinichi Uda
Shinichi Uda
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