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Title:
スイッチ装置とその製造方法
Document Type and Number:
Japanese Patent JP6949372
Kind Code:
B2
Abstract:
To provide a switch device which is suitable for reducing a manufacture cost of an entire switch device or improving reliability as the switch device, and a manufacturing method therefor.SOLUTION: A switch device 1 comprises: a base 3 including a switch mechanism part 2; a connector 4 which is formed so as to be fitted to an outer bottom face 3A of the base 3; and a connection part 5 which connects the base and the connector. The connection part 5 is formed in a shape in which multiple bendable strip-like metal pieces 51 are disposed in parallel, and in a shape in which one end side 51A of each of the strip-like metal pieces is embedded in a side face 3B of the base 3 and another end side 51B of each of the strip-like metal pieces is embedded in an outer bottom face 4A of the connector 4. The base and the connector are integrally molded by a metal mold while using the multiple strip-like metal pieces 51 as a parting line PL. The connector 4 is rotationally moved by folding the multiple strip-like metal pieces 51 to be disposed and fitted to the outer bottom face 3A of the base 3.SELECTED DRAWING: Figure 1

Inventors:
Miyata Chiyoshi
Takeshi Noguchi
Application Number:
JP2018028389A
Publication Date:
October 13, 2021
Filing Date:
February 21, 2018
Export Citation:
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Assignee:
Mick Electronics Industry Co., Ltd.
International Classes:
H01R13/70; H01H23/08; H01R43/24
Domestic Patent References:
JP2014212092A
JP2004207238A
JP2002329457A
JP6068356U
Attorney, Agent or Firm:
Shigenori Wada



 
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