Title:
TAPE AUTOMATED BONDING STRUCTURE FOR SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JP2753696
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a tape automated bonding structure for semiconductor package which can electrically connect the outer lead of an insulating tape to a pad formed on a substrate without detective electrical connection.
SOLUTION: A tape automated bonding structure for semiconductor package is constituted in such a way that a plurality of outer leads 15 is formed on the lower surface of an insulating tape 13 for tape automated bonding(TAB) and the leads 15 are coated with an insulating coating 7 so that the leads 15 can be stuck to pads formed on a substrate with an anisotropic adhesive by breaking the coating 7.
Inventors:
SEN KOSHO
Application Number:
JP328096A
Publication Date:
May 20, 1998
Filing Date:
January 11, 1996
Export Citation:
Assignee:
ERU JII SEMIKON CO LTD
International Classes:
H01L21/60; H01L21/768; H01L23/48; H01L23/498; H01L23/50; (IPC1-7): H01L21/60
Domestic Patent References:
| JP6224252A | ||||
| JP463448A |
Attorney, Agent or Firm:
Fukami Hisaro (3 outside)
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