TAPE PRESS-BONDING DEVICE

Japanese Patent JP2023074768

A

To provide a tape press-bonding device which does not break a wafer even when tape of a frame with tape is press-bonded to a rear surface of the wafer by a press roller.SOLUTION: A tape press-bonding device 2 comprises: an upper chamber 4; a lower chamber 6; a lifting mechanism 8 which generates a closed state in which the upper chamber 4 is lifted/lowered to be in contact with the lower chamber 6 and the open state in which the upper chamber is separated from the lower chamber 6; a vacuum part 10 which makes the upper chamber 4 and the lower chamber 6 vacuous in the closed state; and an atmosphere open part 12 which opens the upper chamber 4 and the lower chamber 6 to the atmosphere. The lower chamber 6 stores a wafer table 32 which has a holding surface 34 formed into the concave shape that supports only an outer periphery excessive region of a wafer and makes the device region non-contact. The tape press-bonding device 2 also comprises positive pressure generation means 48 which supplies the air to a region formed in the concave shape in the wafer table 32 to make the positive pressure with respect to the air pressure of the upper chamber 4 and the lower chamber 6.SELECTED DRAWING: Figure 3

UCHIHO TAKASHI
SAITO YOSHINOBU
KAKINUMA YOSHINORI

JP2021187887A

May 30, 2023

November 18, 2021

Click for automatic bibliography generation  

DISCO ABRASIVE SYSTEMS LTD

H01L21/683

Naozumi Ono
Sachiko Okunuki
Tsuyoshi Tsukano
Yoshifumi Kaneko

Previous Patent: Developing unit, image forming unit and image forming apparatus

Next Patent: Polishing equipment