Title:
TAPE FOR WORKING WAFER
Document Type and Number:
Japanese Patent JP2006156753
Kind Code:
A
Abstract:
To instantly specify a used tape even in the case of storing a tape without removing a wafer and using it another day, by easily identifying the tape for working the wafer pasted to a ring frame for dicing.
In order to manufacture a semiconductor device, the tape for working the wafer is pasted to the ring frame for fixing the wafer for dicing, and the tape is used for an adhering process for superposing with a lead frame or a semiconductor chip. Corresponding to at least a wafer pasting scheduled part on a base material film, an adhesive layer is provided, and printing is performed on the base material film at the pasting scheduled part of the ring frame for dicing.
Inventors:
OKA YOSHIFUMI
YAMAKAWA TAKANORI
ISHIWATARI SHINICHI
TANAKA YASUHIRO
YAMAKAWA TAKANORI
ISHIWATARI SHINICHI
TANAKA YASUHIRO
Application Number:
JP2004345919A
Publication Date:
June 15, 2006
Filing Date:
November 30, 2004
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
H01L21/301; C09J4/00; C09J7/02; H01L21/52
Domestic Patent References:
| JPH097977A | 1997-01-10 | |||
| JP2004072040A | 2004-03-04 | |||
| JP2005162818A | 2005-06-23 |