Title:
TEMPERATURE CONTROL UNIT
Document Type and Number:
Japanese Patent JP3252902
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To hermetically seal a Peltier module in a case with ease by filling the gap between the case and a chip holder around the Peltier module with resin for hermetic sealing, low in moisture absorbency.
SOLUTION: A temperature control unit is basically constituted by sandwiching a Peltier module 1 which exercises temperature control between a metal case 2 and a chip holder 3, high in thermal conductivity. Resin 4 and 5, low in thermal conductivity and moisture absorbency is filled in the gap between the case 2 and the chip holder 3 over the periphery of the chip holder 3 to cut off the space where the Peltier module 1 is mounted from outside air. Since the scope of hermetic sealing is limited to the vicinity of the Peltier module 1 to obviate equipment for welding and the like and only the minimum required area is filled with resin 4 and 5, sufficient hermeticity is obtained and the Peltier module is hermetically sealed with ease and reliability.
Inventors:
Tetsushi Ueda
Application Number:
JP36297398A
Publication Date:
February 04, 2002
Filing Date:
December 21, 1998
Export Citation:
Assignee:
NEC
International Classes:
H01L31/02; F25B21/02; G05D23/20; H01L35/30; H01L35/32; H01S5/00; H01S5/024; (IPC1-7): H01L35/32; F25B21/02; H01L31/02; H01L35/30; H01S5/024
Domestic Patent References:
| JP8125282A | ||||
| JP4252085A | ||||
| JP4105572U |
Attorney, Agent or Firm:
Johei Yamashita
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