Title:
温度応答性デプシペプチドポリマー
Document Type and Number:
Japanese Patent JP4599567
Kind Code:
B2
Abstract:
There is provided a temperature responsive polymer compound which comprises a repeating unit represented by the following general formula (I):
€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ-R 1 -Hmb-R 2 -€ƒ€ƒ€ƒ€ƒ€ƒ(I)
where, Hmb represents a valic acid residue represented by the following formula (II); R 1 represents an amino acid, a polypeptide, or a hydroxy acid being linked by ester bond; R 2 represents an amino acid or a polypeptide being linked by amide bond or a hydroxy acid being linked by ester bond:
and wherein said polymer compound has 18 or more of amino acids residues and hydroxy acid residues in total.
Inventors:
Hiroyuki Oku
Ichiaki Nanari
Tomohiro Taira
Aya Inoue
Keiichi Yamada
Ryoichi Katagai
Ichiaki Nanari
Tomohiro Taira
Aya Inoue
Keiichi Yamada
Ryoichi Katagai
Application Number:
JP2006543073A
Publication Date:
December 15, 2010
Filing Date:
October 20, 2005
Export Citation:
Assignee:
Gunma University
International Classes:
C08G69/44; A61L15/64; C07K11/00; C07K14/00; C08G63/06; C08G69/10
Domestic Patent References:
| JPH05112468A | 1993-05-07 | |||
| JPH07278277A | 1995-10-24 | |||
| JPH08311174A | 1996-11-26 | |||
| JPH107583A | 1998-01-13 | |||
| JP2001187749A | 2001-07-10 |
Attorney, Agent or Firm:
Yoshiyuki Kawaguchi
Hidemi Matsukura
Tsutomu Toyama
Shinichi Sanuki
Hidemi Matsukura
Tsutomu Toyama
Shinichi Sanuki