To provide a heat-sensitive delayed tack type adhesive composition having non-adhesive property at normal temperature, capable of being used without carrying out mold release treatment of a mold-releasing paper or the rear surface of a base material, excellent in blocking resistance at normal temperature, developing adhesive property by short-time heating and excellent in adhesive properties.

The heat-sensitive adhesive composition comprises (A) a thermoplastic resin and (B) a solid plasticizer. The thermoplastic resin (A) is obtained from a radically polymerizable monomer and has a core-shell structure composed of (a1) a shell layer of a polymer in which a glass transition temperature (Tg) is ≥30°C and (a2) a core layer of a polymer in which Tg is ≤0° and a weight ratio of the core layer (a2) to the core layer (a1) is (85/15) to (50/50) and a ratio of the solid plasticizer (B) to 100 pts.wt. thermoplastic resin (A) is >20 pts.wt. and ≤400 pts. wt.

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