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Title:
THERMAL TRANSFER SHEET
Document Type and Number:
Japanese Patent JP2014091324
Kind Code:
A
Abstract:

To provide a thermal transfer sheet printable to a smooth film not subjected to surface treatment such as a film for packaging and further having excellent adhesion, scratch resistance, heat resistance and heat shock resistance in a thermally transferred printed matter.

Provided is a thermal transfer sheet in which the surface of a base material film is at least provided with a release layer, an ink layer and an adhesive layer, and the opposite side thereof is provided with a heat resistant lubricity layer, the adhesive layer comprises a novolak type phenol resin and a polyamide resin in which the softening point (softening point JIS K5601-2-2(1999) by a ring and ball method) lies in the range of 100 to 160°C, and the ink layer comprises a thermoplastic resin in which the softening point (ring and ball method) lies in the range of 75 to 170°C as the main component.


Inventors:
OTA TADASHI
HORI YOSHIYUKI
SOWA KAZUHIRO
Application Number:
JP2012253668A
Publication Date:
May 19, 2014
Filing Date:
November 02, 2012
Export Citation:
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Assignee:
DYNIC CORP
International Classes:
B41M5/382; B41M5/42
Domestic Patent References:
JPS62189192A1987-08-18
JPH0334890A1991-02-14
JPH0358887A1991-03-14
JPH0664356A1994-03-08
JP2002137553A2002-05-14
JP2002137552A2002-05-14