Title:
THERMOPLASTIC OLEFIN RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3343438
Kind Code:
B2
Abstract:
PURPOSE: To obtain a thermoplastic olefin resin composition which is heat- bonded to a thermoplastic resin container, sheet or the like, and can be easily released from the container, sheet or the like when it is released therefrom afterwards.
CONSTITUTION: This composition is one comprising 20-70wt.% olefin resin, 10-50wt.% olefin elastomer, 10-50wt.% styrene elastomer, 5-40wt.% modified olefin polymer obtained by subjecting 30-95wt.% olefin polymer and 70-5wt.% vinyl monomer to graft reaction conditions, and 5-30wt.% tackifier.
Inventors:
Hiroyuki Sato
Eiji Kimura
Eiji Kimura
Application Number:
JP10264894A
Publication Date:
November 11, 2002
Filing Date:
May 17, 1994
Export Citation:
Assignee:
Mitsubishi Chemical Corporation
International Classes:
C08L23/02; C08F2/00; C08F2/18; C08F255/00; C08L23/00; C08L23/16; C08L25/00; C08L25/02; C08L51/00; C08L51/06; C08L53/02; C08L57/00; C08L57/02; C08L89/00; C08L91/00; C08L93/00; C08L93/02; C08L93/04; (IPC1-7): C08L23/02; C08L23/16; C08L51/06; C08L53/02; C08L93/04
Attorney, Agent or Firm:
Soga Doteru (6 people outside)
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