Title:
THERMOPLASTIC RESIN COMPOSITION AND COMPATIBILIZER TO BE USED THEREFOR
Document Type and Number:
Japanese Patent JP3876056
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain the subject composition that has excellent shock resistance and processing fluidity, holds good appearance after molding and shows improved weld adhesion strength by formulating a specific resin, a copolymer and crosslinked elastomer copolymer.
SOLUTION: The objective thermoplastic resin composition comprises (A) 50-90 pts.wt. of polycarbonate resin, polyamide resin or polyester resin (preferably a polycarbonate resin), (B) 50-10 pts.wt. of styrene resin or polyphenylene resin, for example, shock-resistant polystyrene resin, (C) 0.05-20 pts.wt., per 100 pts.wt. of A+B, of a copolymer essentially containing a formamide group- bearing monomer of the formula (R1-R6 are each H or the like) preferably in an amount of 0.05-20 wt.% and an aromatic vinyl monomer preferably in an amount of ≥60 wt.%, and (D) 0.05-20 pts.wt. of a cross-linked elastomer copolymer essentially from the above-stated formamide group-bearing monomer (preferably in an amount of 0.05-20 wt.%) and an elastomer component monomer (preferably in ant amount of ≥50 wt.%).
Inventors:
Kikuta Manabu
Makoto Teramoto
Hiroshi Hotta
Makoto Teramoto
Hiroshi Hotta
Application Number:
JP21435397A
Publication Date:
January 31, 2007
Filing Date:
August 08, 1997
Export Citation:
Assignee:
Daiichi Kogyo Pharmaceutical Co., Ltd.
International Classes:
C08L19/00; C08L69/00; C08F246/00; C08L25/04; C08L25/08; C08L55/02; C08L67/00; C08L77/00; (IPC1-7): C08L69/00; C08L19/00; C08L25/04; C08L25/08; C08L55/02; C08L67/00; //C08F246/00
Domestic Patent References:
| JP3160004A | ||||
| JP10237296A | ||||
| JP10060290A | ||||
| JP6322259A | ||||
| JP10508051A |
Attorney, Agent or Firm:
Masahiko Nishito