Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THERMOPLASTIC RESIN PARTICLE COMPOSITION, THERMOPLASTIC RESIN MOLDING USING THE COMPOSITION, AND METHOD FOR PRODUCING THE MOLDING
Document Type and Number:
Japanese Patent JP2010173144
Kind Code:
A
Abstract:

To produce a thermoplastic resin molding which, when electromagnetic wave irradiation molding is carried out, performs smooth packing of thermoplastic resin particles into a cavity, can prevent the occurrence of faults such as burning, and is excellent in quality including appearance, shape, and surface accuracy and mechanical strengths.

A thermoplastic resin particle composition 6A is used in a process in which it is packed in the cavity 22 of a rubber mold 2 made of a rubber material and heated/melted by being irradiated with electromagnetic waves including a wavelength domain of 0.78-2 μm. The thermoplastic resin particle composition 6A contains thermoplastic resin particles 61 and fine particles 62 of inorganic powdered matter and/or a lubricant. The number average particle size of the thermoplastic resin particles 61 is 200-3,000 μm, and the number average particle size of the fine particles 62 is 0.5-50 μm. In the thermoplastic resin particle composition 6A, 0.1-10 pts.mass of the fine particles 62 are contained per 100 pts.mass of the thermoplastic resin particles 61.


Inventors:
KURIHARA FUMIO
Application Number:
JP2009016817A
Publication Date:
August 12, 2010
Filing Date:
January 28, 2009
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TECHNO POLYMER CO LTD
NIPPON REKKUSU KK
International Classes:
B29C45/00; B29C33/06; B29C33/40; B29C43/02; B29C45/14; B29K25/00
Domestic Patent References:
JP2007216447A2007-08-30
JP2007106881A2007-04-26
JP2004161791A2004-06-10
JP2004068004A2004-03-04
Attorney, Agent or Firm:
Patent Business Corporation Aichi International Patent Office