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Title:
THERMOPLASTIC RESIN PARTICLE COMPOSITION, THERMOPLASTIC RESIN MOLDING USING THE SAME, AND METHOD FOR PRODUCING THE MOLDING
Document Type and Number:
Japanese Patent JP2010173143
Kind Code:
A
Abstract:

To provide a thermoplastic resin particle composition which can produce a thermoplastic resin molding which, when electromagnetic wave irradiation molding is carried out, performs smooth packing of thermoplastic resin particles into a cavity, can prevent the occurrence of faults such as burning, and is excellent in quality including shape, appearance, and surface accuracy and mechanical strength, the thermoplastic resin molding using the composition, a method for producing the molding.

The thermoplastic resin particle composition 6A is used in a process in which it is packed in the cavity 22 of a rubber mold 2 made of a rubber material and heated/melted by being irradiated with electromagnetic waves including a wavelength domain of 0.78-2 μm through the rubber mold 2. The thermoplastic resin particle composition 6A contains 0.1-20 mass% of small thermoplastic resin particles 62 1-100 μm in particle size and large thermoplastic resin particles 61 of 200-3,000 μm in particle size as the residual portion.


Inventors:
KURIHARA FUMIO
Application Number:
JP2009016816A
Publication Date:
August 12, 2010
Filing Date:
January 28, 2009
Export Citation:
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Assignee:
TECHNO POLYMER CO LTD
NIPPON REKKUSU KK
International Classes:
B29C45/00; B29C33/06; B29C33/40; B29C43/02; B29C45/14; B29K25/00
Domestic Patent References:
JP2008012896A2008-01-24
JP2007216447A2007-08-30
JP2004068004A2004-03-04
JP2004161791A2004-06-10
Attorney, Agent or Firm:
Patent Business Corporation Aichi International Patent Office