To obtain an adhesive composition exhibiting a large flow resistance when subjected to thermo-contact bonding and high soldering heat resistance by compounding a polyethylenic copolymer bearing an epoxy group in the molecule, a rosin bearing a carboxylic group in the molecule and inorganic colloid.
An adhesive composition comprises 40-98 wt.% of a polyethylenic copolymer (A) bearing an epoxy group in the molecule, 1-50 wt.% of a thermoplastic polymer (C) bearing no epoxy group in the molecule, a carboxylic group- containing rosin (B) having a softening temperature of 50-200°C and an acid number of 100-300, and further 1-40 wt.% of inorganic colloid having an average particle size of 1-100 nm such as silica colloid or the like and has a storage elastic modulus at 250°C of 1×104 to 1×107 Pa. As the component A, there can be exemplified a two-component copolymer of glycidyl (meth)acrylate with ethylene, a three-component copolymer of glycidyl (meth)acrylate, vinyl acetate and ethylene, and the like. The curing reaction is effected by heating at 120°C or higher for one min to 24 hr to attain sufficient adhesivity.
ISHII SHIGEYOSHI
ITO KOJI
CHOKAI NAOYUKI
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