THERMOSETTING ADHESIVE COMPOSITION AND ADHESIVE TAPE FOR ELECTRONIC PARTS USING THE SAME

Title:

THERMOSETTING ADHESIVE COMPOSITION AND ADHESIVE TAPE FOR ELECTRONIC PARTS USING THE SAME

Document Type and Number:

Japanese Patent JP2005307152

Kind Code:

A

Abstract:

To provide a thermosetting adhesive composition that can improve flexibility and high temperature reliability by increasing the interface adherence between the substrate film and the adhesive and provide a thermosetting adhesive composition that is useful for a flexible printing circuit board.

This thermosetting adhesive composition that is useful for flexible printed circuit substrate comprises (1) a butadiene-acrylonitrile copolymer including a carboxyl polyamide carbonyl group (A) represented by the chemical formula 1 (wherein A=100-B, in this case, A is 1 to 99 and individually shows the molar ratio, as for k, m and n, when k=1, m=3 to 200 and n=0.20 to 100 and they show the molar ratios; R1 and R2 are each 1-20C aliphatic hydrocarbon and R3 is 1-20C alkyl and O, P and Q are each an integer of 1 to 20) and a polysiloxane-aminocarbonyl group (B) and (2) an epoxy resin.

Inventors:

CHANG KYEONG HO
KIM KOAN MU
KWON JEONG MIN
LEE GYEONG ROK
PARK DOUKU HA

Application Number:

JP2004264970A

Publication Date:

November 04, 2005

Filing Date:

September 13, 2004

Export Citation:

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Assignee:

SAEHAN MICRONICS INC

International Classes:

B32B27/00; B32B27/34; B32B27/38; C09J11/06; C09J125/12; C09J133/20; C09J147/00; C09J161/06; C09J161/18; C09J163/00; C09J177/00; C09J183/04; (IPC1-7): C09J125/12; B32B27/00; B32B27/34; B32B27/38; C09J11/06; C09J133/20; C09J161/06; C09J161/18; C09J163/00; C09J177/00; C09J183/04

Attorney, Agent or Firm:

Tsuyoshi Hashimoto
Tomioka Kiyoshi

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