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Patent Searching and Data


Title:
THERMOSETTING COMPOSITION AND METHOD FOR CURING
Document Type and Number:
Japanese Patent JPH08127606
Kind Code:
A
Abstract:

PURPOSE: To obtain a thermosetting composition, capable of promoting the thermosetting reaction by photoreaction and efficiently initiating the thermosetting reaction, curable with a small amount of a catalyst in a short time and useful for resists, etc., by combining a light absorbing compound with a thermosetting compound.

CONSTITUTION: This composition contains (A) a thermosetting compound and (B) a light absorbing compound. Furthermore, a mixture of (i) any of an isocyanate compound, a polyorganic acid compound, a polyorganic acid anhydride, an epoxy compound and a melamine compound with (ii) any of a polyol compound, a polyphenol compound, a polyamine compound and a compound containing polymercapto groups, a mixture of the polyorganic acid compound with the isocyanate compound or the epoxy compound, etc., are preferably used as the component (A) and a compound, having the absorption in the region of near infrared rays and represented by the formula D+.A- (D+ is a cation having the absorption in the region of near infrared rays; A is various anions) is preferably used as the component (B).


Inventors:
SUGITA SHUICHI
KAMATA HIROTOSHI
HOSODA KIICHI
Application Number:
JP26554194A
Publication Date:
May 21, 1996
Filing Date:
October 28, 1994
Export Citation:
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Assignee:
SHOWA DENKO KK
International Classes:
C08L61/28; C08F2/46; C08F2/48; C08G18/08; C08G18/28; C08G18/40; C08G59/18; C08G85/00; C08L61/20; C08L63/00; (IPC1-7): C08F2/46; C08G18/08; C08G59/18; C08G85/00; C08L61/28; C08L63/00
Attorney, Agent or Firm:
Yaguchi flat