熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ

Title:

熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ

Document Type and Number:

Japanese Patent JP6369134

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that is excellent in low shrinkage property, low thermal expansion property and desmear resistance property, and to provide a prepreg, film with resin, laminate sheet, multilayer printed circuit board and semiconductor package using the same.SOLUTION: Provided is a thermosetting resin composition in which a maleimide compound represented by the general formula (1) (A), and an amino-modified siloxane compound having an aromatic azomethine group in the molecular structure (B) are formulated.

More Like This:

JP4291922	Material separation reducing agent for cement composition
JP2006276195	UV-CURABLE RESIN COMPOSITION, AND OPTICAL ELEMENT, LAMINATED DIFFRACTIVE OPTICAL ELEMENT AND OPTICAL SYSTEM MOLDED BY THE SAME
JPH04352884	PIGMENT DISPERSANT

Inventors:

Shinichiro Abe
Murai Yo
Shin Takanezawa
Masato Miyatake
Tomohiko Kotake
Nagai Shunsuke
Hashimoto Shintaro

Application Number:

JP2014110638A

Publication Date:

August 08, 2018

Filing Date:

May 28, 2014

Export Citation:

Click for automatic bibliography generation Help

Assignee:

Hitachi Chemical Co., Ltd.

International Classes:

C08L39/04; B32B27/00; C08J5/18; C08J5/24; C08K5/18; C08L83/08; H01L23/14; H05K1/03

Domestic Patent References:

JP6263843A

Attorney, Agent or Firm:

Tamotsu Otani
Kenichi Hirasawa
Kosuke Sawayama

Previous Patent: 情報処理装置およびプログラム

Next Patent: ELECTRONIC DETECTOR