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Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS54162741
Kind Code:
A
Abstract:

PURPOSE: The title composition having improved mechanical properties, crack resistance, and moldability, without degrading the fluidity, comprising surface treated mica or its mixture with a filler.

CONSTITUTION: A composition comprising (A) a thermosetting resin, (B) 0.1W80 wt.%, preferably 1W50 wt.% of natural mica, e.g. phlogopite, or synthetic one, e.g. fluophlogopite, having a maximum particle size ≤10 mesh, preferably ≤100 mesh, prepared by immersing 100 parts by wt. of mica powder in a solution containing 0.1W50 parts by wt., preferably 1.0W10 parts by wt., of a surface treatment in water or an organic solvent, and by removing the water or solvent, or its mixture with another filler. A silane coupling agent, organic monocarboxylic acid, surfactant, or solicone resin, may be cited as the treatment.


Inventors:
FUKUSHIMA JIROU
YASUDA KAZUO
SHIBAYAMA KIYOUICHI
Application Number:
JP7253978A
Publication Date:
December 24, 1979
Filing Date:
June 14, 1978
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
C08K9/00; C08K9/04; C08L7/00; C08L21/00; C08L63/00; C08L67/00; C08L67/06; (IPC1-7): C08K9/04; C08L63/00; C08L67/06



 
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