Title:
THIN FILM CAPACITOR AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3253756
Kind Code:
B2
Abstract:
PURPOSE: To prevent the short circuit between lower and upper electrodes with reliability and significantly improve the yield and reliability of products by forming the lower electrode into air bridge shape including a bridge that is to provide a specified void between the lower electrode and the substrate surface, and depositing an insulating film and an upper electrode on the bridge.
CONSTITUTION: The flat surface 20a of patterned resist 20 on the surface 10a of a substrate 10, is subjected to vapor deposition or sputtering almost perpendicularly to the substrate 10 to form a lower electrode 14. An insulating film 16 is formed on the surface of the lower electrode 14, and an upper electrode 18 is formed on the surface of the insulating film 16. The substrate 10 is then immersed in an organic solvent to dissolve the resist 20. This forms a void A between the substrate 10 and the lower electrode 14, which gives the lower electrode an air bridge structure.
Inventors:
Akihiro Masuko
Application Number:
JP13531693A
Publication Date:
February 04, 2002
Filing Date:
May 13, 1993
Export Citation:
Assignee:
Shimada Rika Co., Ltd.
International Classes:
C01B21/076; H01G4/00; H01G4/06; H01G4/33; (IPC1-7): H01G4/33; C01B21/076; H01G4/00
Domestic Patent References:
| JP63263711A | ||||
| JP62299051A | ||||
| JP199207A | ||||
| JP3203210A |
Attorney, Agent or Firm:
Junichi Ueshima