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Title:
THIN FILM ELECTRONIC DEVICE PROTECTIVE FILM AND OF THIN FILM ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JPS61110471
Kind Code:
A
Abstract:
PURPOSE:To obtain a thin film electronic device protective film which has a simple structure, a low cost and ready availability by laminating thermoplastic resin contained in a netlike insulator on an aluminum foil. CONSTITUTION:Thermoplastic resin 2 can employ (A) alpha,beta-unsaturated carboxylic acid or modified polyethylene graft-modulated by its anhydride or modified- ethylene-unsaturated ester copolymer and (B) polymer of vinyl aromatic hydrocarbon or adhesive composition mixed with polymer of halogenated ethylene. This resin has good adhesive with thin film electron device to be protected from the aluminum foil 1, and does not reduce the characteristics of the device by cooling heat cycle. Netlike insulator 3 uses woven fabric or nonwoven fabric such as polyethylene terephthalate fiber, polyamide fiber or Rayon fiber having higher melting point than the resin 2.

Inventors:
NAKANO AKIHIKO
IKEGAMI SEIJI
MATSUOKA NAOKI
IJICHI ICHIRO
Application Number:
JP23264684A
Publication Date:
May 28, 1986
Filing Date:
November 05, 1984
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
NITTO ELECTRIC IND CO
International Classes:
H01L31/04; H01L31/042; H01L31/048; (IPC1-7): H01L31/04
Domestic Patent References:
JPS5898984A1983-06-13
JPS57162374A1982-10-06
JPS551115A1980-01-07
JPS5817685A1983-02-01
JPS5817684A1983-02-01
Attorney, Agent or Firm:
Akira Kobiji (2 outside)