To provide a thin groove processing machine which provides a uniform thin groove form by eliminating chips without electrostatic attachment by properly selecting a processing method of the concentric circular or cross-cut thin groove in accordance with material of a cutting material by mechanical work on a pad used for a semi-conductor CMP process.

This thin groove processing machine of the pad for the semi-conductor CMP process is devised to facilitate discharge of the chips by neutralizing static electricity of the pad and the chips by a blowing flow of an ion blow nozzle provided in the neighborhood of a tool in processing by providing: a circular table 1 C-axially controlled around a vertical axis adsorbing and fixing the foaming urethane pad; a gantry type column 11 X-axially controlled by straddling over the circular table; a saddle to Y-axially move on the gantry type column; tool rests 18, 19 Z-axially controlled on the saddle; a fixed tool (turning, cutting) free to exchange the tool on the tool rest; and a rotating tool unit (milling cutter, drill).

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