DIE SUPPLY PACKAGE EXCHANGING DEVICE FOR DIE BONDER

Japanese Patent JPH0774189

A

PURPOSE: To make the dead time of a machine as short as possible at the time of change to a different kind of die and obtain an equipment capable of dealing with various kinds of dies, by installing a magazine storing a plurality of die supply packages, a specified clamp assembling member and an indexing means. CONSTITUTION: This equipment is provided with a magazine 10 storing a plurality of die supply packages 12 and a clamp assembly 40 having a first and a second clamping means which are rotatable around an axial line 62. The respective clamping means collect the die supply packages 12 selected from the magazine 10, and supply the die supply packages 12 to a die ejecting station. After a specified number of dies are taken out and returned to the magazine 10, the die supply packages 12 are withdrawn from the die ejecting station. An indexing means which indexes movements of the die supply packages 12 in the magazine 10, and a means which indexes rotation of the clamp assembly 40 around the axial line 62 are also installed.

WO/2001/037376	ARRANGEMENT FOR ELECTRICALLY CONNECTING CHIPS IN A CIRCUIT THAT IS EMBODIED IN A THREE-DIMENSIONAL MANNER
WO/2001/073957	BATTERY-OPERATED WIRELESS-COMMUNICATION APPARATUS AND METHOD
JP3217832	METHOD FOR MANUFACTURING MICRO-STRUCTURE BY USING NON-PLANAR EXPOSURE BEAM LITHOGRAPHY AND APPARATUS THEREFOR

KARURU SHIYUBUAITSUAA
GERUHARUTO TSUAINDORU

JP4834591A

March 17, 1995

March 13, 1991

Click for automatic bibliography generation  

EMHART INC

H01L21/00; H01L21/52; H01L21/677; H01L21/687; H01L21/50; (IPC1-7): H01L21/52; H01L21/50; H01L21/68

Minoru Nakamura (7 outside)

Next Patent: TOOL EXCHANGING DEVICE FOR HYBRID DIE BONDER