Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2814560
Kind Code:
B2
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Inventors:
Masaki Hirota
Application Number:
JP12863889A
Publication Date:
October 22, 1998
Filing Date:
May 24, 1989
Export Citation:
Assignee:
Nissan Motor Co., Ltd
International Classes:
H01L29/78; H03K17/08; H03K17/12; H03K17/14; H03K17/16; (IPC1-7): H03K17/08; H03K17/12; H03K17/14; H03K17/16
Domestic Patent References:
| JP55136828A | ||||
| JP489447A |
Attorney, Agent or Firm:
Hidekazu Miyoshi (1 outside)