Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP3016663
Kind Code:
B2
Abstract:
PURPOSE:To prevent external light from passing through a protective film and an insulating film and reaching a semiconductor circuit, and to ensure the safety of the operation of a semiconductor circuit. CONSTITUTION:On the surface of a semiconductor chip 1, a semiconductor circuit, 2 is formed at the center thereof, and a bonding pad 3A is formed on the periphery thereof. All areas except the bonding pad 3A on the surface of the semiconductor chip 1 are covered with a protective film 5, and the whole surface of the protective film 5 is coated with a first insulating film 6 made of a resin-based material. The surface of the first insulating film 6 other than the periphery thereof is covered with a shielding film 4 made of aluminum, and the whole surface of the shielding film 4 is coated with a second insulating film 7B made of resin-based material. External light fails to reach the semiconductor circuit 2 by being shielded by the shielding film 5.
Inventors:
Yasushi Kanan
Application Number:
JP24775792A
Publication Date:
March 06, 2000
Filing Date:
September 17, 1992
Export Citation:
Assignee:
Matsushita Electronics Industrial Co., Ltd.
International Classes:
H01L21/60; H01L23/29; H01L23/31; (IPC1-7): H01L23/29; H01L21/60; H01L23/31
Domestic Patent References:
| JP5465478A | ||||
| JP559417A | ||||
| JP1183137A | ||||
| JP6214736U |
Attorney, Agent or Firm:
Hiroshi Maeda (2 outside)