Title:
【発明の名称】基板の研磨方法及び研磨装置
Document Type and Number:
Japanese Patent JP3011113
Kind Code:
B2
Abstract:
A method and device for polishing a substrate capable of accurate detection of a terminating point of polishing employing a polishing pad and a slurry. The polishing device includes a bed formed with a polishing pad on the surface and driven for rotation, a carrier rotatable above the bed and reciprocally movable with respect to the surface of the bed, and holding the substrate to be polished and slurry supply means for supplying a slurry as an abrasive to the surface of the polishing pad. Polishing of the surface of the substrate is performed by the abrasive and the polishing pad while pressing the substrate held by the carrier onto the polishing pad. During polishing, bowing condition of the substrate is detected by means of a bowing detector provided on the carrier to detecting a terminating point of polishing on the basis of bowing condition for stopping polishing operation of respective of the bed, carrier and the slurry supply means.
Inventors:
Toru Kubo
Application Number:
JP30526796A
Publication Date:
February 21, 2000
Filing Date:
November 15, 1996
Export Citation:
Assignee:
NEC
International Classes:
B24B37/013; B24B49/02; B24B49/12; (IPC1-7): B24B37/04; H01L21/304
Domestic Patent References:
| JP55141731A | ||||
| JP5123965A |
Attorney, Agent or Firm:
Suzuki Akio