Title:
CORRECTING METHOD FOR LEAD
Document Type and Number:
Japanese Patent JPS5929431
Kind Code:
A
Abstract:
PURPOSE:To bring a stable bonding state of an inner lead, in which there is no edge touch, without executing a lead correction process separated from bonding work by providing bonding operation with a function on operation correcting the deformation of the lead. CONSTITUTION:A film tape 1 is positioned and moved upward while being held by tape guides 11 under the state of bonding operation in which a bonding tool 10 pushes down an inner lead 3 and bumps 6. Touches at edges of the inner lead 3 and the sag of the lead causing the deformation of the lead are corrected at that time. When the bonding tool 10 is elevated and a bonding state 9 is held by wax in order to separate a semiconductor element 5 being bonded, the stage 9 is moved downward and separated, the element is separated by breaking vacuum when the element is adsorbed and held under vacuum, and bonding is completed.
Inventors:
AOYAMA HIROSHI
Application Number:
JP14025582A
Publication Date:
February 16, 1984
Filing Date:
August 12, 1982
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Uchihara Shin