PURPOSE: To provide the optical semiconductor module which sufficiently maintains the airtightness in a package and secures mass-productivity while actualizing direct connections between optical array elements and an optical fiber array as to connection terminals of the optical fiber array to be connected to the optical array terminals.

CONSTITUTION: The semiconductor module is constituted of a plate material 21 which has one surface 21a adhered to the outside wall surface of the package and has a flange part sealing the package, a through hole 22 which is formed in the plate material 21 and has solder 27d charged in a gap while the optical fiber array 23 is inserted, and end part holders 24a, 24b, and 26 which are fixed to one surface 21a of the plate material 21 and where the end part of the optical fiber array 23 inserted into the package from the insertion hole of the package and inserted into the insertion hole 22 is fixed.