Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2901209
Kind Code:
B2
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Inventors:
FURUKAWA HIDETOSHI
HIROSE MASANORI
KANAZAWA KUNIHIKO
SUGIMURA AKIHISA
HIROSE MASANORI
KANAZAWA KUNIHIKO
SUGIMURA AKIHISA
Application Number:
JP15852591A
Publication Date:
June 07, 1999
Filing Date:
June 28, 1991
Export Citation:
Assignee:
MATSUSHITA DENSHI KOGYO KK
International Classes:
H01L21/304; H01L23/34; H01L29/80; (IPC1-7): H01L29/80; H01L21/304; H01L23/34
Domestic Patent References:
| JP51273A | ||||
| JP6377162A | ||||
| JP6154674A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)