Title:
RESIN SEALING METHOD FOR ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JPS60119734
Kind Code:
A
Abstract:
PURPOSE:To enable to perform a continuous automatic molding as well as to contrive improvement in dimensional accuracy by a method wherein, using low viscosity epoxy resin which is in viscous state at normal temperature, an injection molding is performed at low pressure using a screw type injection molding machine. CONSTITUTION:Using low viscosity epoxy resin which is viscous at normal temperature, an injection molding is performed at low pressure using a screw type injection molding machine. The viscosity of said epoxy resin is to be at 10<2>-10<4> poise in a mold when injection molding is performed. With this viscosity, no electronic parts such as the bonding wire of IC and the like are damaged or deformed, and the viscosity of that extent is necessary for the performance of an injection molding. When the viscosity is increased to 10<4> poise or above, injection output is made larger, and the bonding wire of IC and the like are damaged or deformed. Also, the epoxy resin used contains an inorganic filler of 40- 80wt%. As a result, the characteristics of electric parts can be maintained, and the damage generated by thermal and mechanical factors can be suppressed to the minimum.
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Inventors:
YAMAMOTO SHINJI
SAKAI TADAKI
SHIROGANEYA TSUKASA
SAKAI TADAKI
SHIROGANEYA TSUKASA
Application Number:
JP22740983A
Publication Date:
June 27, 1985
Filing Date:
December 01, 1983
Export Citation:
Assignee:
JAPAN STEEL WORKS LTD
International Classes:
H01C17/02; B29C45/14; H01G4/00; H01G4/224; H01L21/56; B29K63/00; B29L31/34; (IPC1-7): B29C45/14; B29K63/00; B29L31/34; H01C17/02; H01G1/02; H01G4/00
Domestic Patent References:
| JPS5892547A | 1983-06-01 |
Attorney, Agent or Firm:
Takakuwa Haruo