TREATING DEVICE FOR WAFER SURFACE

Japanese Patent JPS605530

A

PURPOSE:To quicken a treating time for washing and drying and to enhance the effects of washing and drying by a method wherein a wafer conveying part is respectively formed between a loader part and a washing station, between the washing station and a drying station and between the drying station and an unloader part. CONSTITUTION:A wafer 4 transferred on the rotating table 12 of a washing station B is fixed in an attracted state at a prescribed place. Then, water is injected to the surface of the wafer 4 from jet nozzles 13 and stuck dusts are washed and removed. After that, the jet of water is stopped and hydro-extraction is performed while the rotation of the rotating table 12 is continued in a condition that the wafer 4 has been attracted to the rotating table and the wafer is made to dry provisionally. After then, the table 12 is successively made an intermittent drive and the wafer 4 is transferred to a drying station D. Then, the drying station D is held in the nitrogen atmosphere and the wafer held by wafer holders 16 is made to dry while a rotating table 15 is made to rotate. The rotation of the table 15 is stopped, and after that, while the rotating table 15 is made an intermittent drive, the wafer, which ended a drying treatment, is accomodated in one of empty wafer cartridges 18 installed on the rotating table 17 of an unloader part E.

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JP2007098361	SUBSTRATES PROCESSING APPARATUS

NAGATOMO HIROTO
SEKI HISAO
TAKAGAKI TETSUYA

JP8178484A

January 12, 1985

April 25, 1984

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HITACHI LTD

B08B3/02; H01L21/00; H01L21/304; (IPC1-7): H01L21/304; B08B3/02

JPS5295967A	1977-08-12
JPS5358458A	1978-05-26
JPS5216875A	1977-02-08

Katsuo Ogawa

Next Patent: JPS605531