PURPOSE: To enable to convert swiftly and inexpensively into a mold for a printed circuit boad having a different pattern, thickness and shape, by providing a matrixlike hole, to which a pin is fitted, on a part of a component consisting a cavity.

CONSTITUTION: A lower cavity plate 4 is provided with holes of 1mm at intervals of 0.1 inch in a matrixlike state, a press plate 5 of a pin is provided also with holes which are larger than 1mm in accordance with each of the holes of the lower cavity plate 4 and the holes each of the press plate 5 are set with pins in accordance with patterns of a printed circuit board. To change the patterns of the board, a fixing screw 11 of the press plate 5 of the pin is slackened, the lower cavity plate 4 and press plate 5 of the pin are removed and a base pin 1 and through hole pin 2 are changed. Then to change the diameter of a through hole, a thin-diameter through hole pin 3 is used. The changes of a shape and thickness of the molded printed board 6 are performed by a change of a shaping plate 14.