Title:
CONTROL METHOD OF QUANTITY OF ETCHING
Document Type and Number:
Japanese Patent JPS59181621
Kind Code:
A
Abstract:
PURPOSE:To control the quantity of etching of a member to be etched by monitoring the etching of a resistance element and the change of a resistance value when the resistance element is mounted previously near the member to be etched and the member is etched. CONSTITUTION:Substrate 1... to be etched are dry-etched under the state in which resistance elements 20 are arranged near the substrate 1.... When an insulating layer 3c on the substrate 1 is etched to bore windows, the resistance elements 20 are also etched simultaneously. Consequently, the resistance values of the resistance elements 20 gradually increase. Since the increase of the resistance values is proportional to the depth of etching of the insulating layer 3c, only the insulating layer 3c is etched by monitoring the increase of the resistance values of the resistance elements 20 by a measuring instrument when relationship between the quantities of increase of the resistance of the resistance element 20 and the quantity of the insulating layer 3c etched is obtained previously, and the etching can be suspended at a point of time when the insulating layer is not etched in conductor patterns 4 and permalloy patterns 5.
Inventors:
OZAKI KIYOSHI
Application Number:
JP5640083A
Publication Date:
October 16, 1984
Filing Date:
March 31, 1983
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L21/302; H01L21/3065; (IPC1-7): H01L21/302
Attorney, Agent or Firm:
Minoru Aoyagi