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Title:
ELECTROMAGNETIC WAVE-SHIELDING SYNTHETIC RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JPS5938244
Kind Code:
A
Abstract:

PURPOSE: To provide a synthetic resin molding material which has a high electromagnetic wave-shielding effect due to excellent magnetic properties of amorphous metal and reduces the degree of the crushing or the breaking of metal in a kneading stage or a plasticizing stage, consisting of amorphous metal and a synthetic resin.

CONSTITUTION: The titled material consists of an amorphous metal of the formula MaXb (wherein M is at least one member selected from among Fe, Co, and Ni; X is at least one member selected from among Si, B, C, P, and Al; a=70W 85wt%, b=30W15wt%; when 0.5W10wt% Ti, V, Cr or Mn is added, soft magnetic properties and thermal stability are improved; metal is used in the form of thin film, thick film, thin leaf, thin belt, powder or fiber) and a synthetic resin such as thermoplastic or thermosetting resin. By incorporating the amorphous metal, the degree of the crushing or the breaking of the metal in the manufacturing stage is reduced and there can be obtd. a synthetic resin molding material having a high electromagnetic wave-shielding effect due to excellent magnetic properties of the amorphous metal. The material is suitable for use as a molding material for the cabinet of electrical appliances such as microcomputer.


Inventors:
MURAYAMA TOORU
ARAKAWA YASUSHI
KUMIYAMA TOSHIO
Application Number:
JP14851682A
Publication Date:
March 02, 1984
Filing Date:
August 28, 1982
Export Citation:
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Assignee:
TOSHIBA CHEM PROD
TOKYO SHIBAURA ELECTRIC CO
International Classes:
C08K3/00; C08K3/02; C08K3/08; C08L1/00; C08L7/00; C08L21/00; C08L23/00; C08L27/00; C08L51/00; C08L51/02; C08L67/00; C08L77/00; C08L101/00; H01B1/22; H05K9/00; (IPC1-7): C08K3/08; H01B1/22; H05K9/00
Domestic Patent References:
JPS57187357A1982-11-18
Attorney, Agent or Firm:
Eiji Morota