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Patent Searching and Data


Title:
タッチパネル
Document Type and Number:
Japanese Patent JP7036094
Kind Code:
B2
Abstract:
The method for forming a resin cured film pattern according to the invention comprises a first step in which there is formed on a base material a photosensitive layer composed of a photosensitive resin composition comprising a binder polymer with a carboxyl group having an acid value of 75 mgKOH/g or greater, a photopolymerizable compound and a photopolymerization initiator, and having a thickness of 10 μm or smaller, a second step in which prescribed sections of the photosensitive layer are cured by irradiation with active light rays, and a third step in which the sections of the photosensitive layer other than the prescribed sections are removed to form a cured film pattern of the prescribed sections of the photosensitive layer, wherein the photosensitive resin composition comprises an oxime ester compound and/or a phosphine oxide compound as the photopolymerization initiator.

Inventors:
Taiji Murakami
Hiroshi Yamazaki
Yuzo Igarashi
Naoki Sasahara
Ikuo Mukai
Application Number:
JP2019165428A
Publication Date:
March 15, 2022
Filing Date:
September 11, 2019
Export Citation:
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Assignee:
Showa Denko Materials Co., Ltd.
International Classes:
G03F7/031; G03F7/004; G03F7/029; G03F7/033; G06F3/041
Domestic Patent References:
JP2000332424A
JP2015135491A
JP2015087749A
JP2011081041A
JP2012215837A
JP7256832A
Foreign References:
WO2011129210A1
WO2011129312A1
WO2013084886A1
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Sasaki