Title:
TRANSPARENT THERMAL CONDUCTIVE ADHESIVE FILM AND ITS APPLICATION
Document Type and Number:
Japanese Patent JP2009197185
Kind Code:
A
Abstract:
To provide a transparent thermal conductive adhesion film which has high transparency and high thermal conductivity, can increase the thermal conductivity easily at low cost, and has stable quality and durability.
The transparent thermal conductive adhesive film is an adhesive film comprising a resin and transparent/white fine particles. One or more crests (peaks) of a frequency particle diameter distribution of the fine particles are observed in each of a range of 3-100 m and a range of 0.004-0.5 m.
Inventors:
HOSHINO TETSUYA
Application Number:
JP2008042844A
Publication Date:
September 03, 2009
Filing Date:
February 25, 2008
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J7/00; C09J11/06; G02B5/02; H01L33/48; H01L33/62; H01L33/64