PURPOSE: To house semiconductor devices of different external dimensions in both faces of a tray for a semiconductor device and improve the efficiency of the tray by making recessions capable of housing the semiconductor devices in both faces of a substrate.

CONSTITUTION: A substrate 1 of, for example, synthetic resin is shaped into a semiconductor device tray having recessions 3 and 4 capable of housing semiconductor devices 2 in both faces thereof. The recessions 3 and 4 are made in sizes corresponding to the different external dimensions of the semiconductor devices. Steps 5 are made in the periphery of the substrate 1 so that when a plurality of semiconductor device trays in which the semiconductor devices 2 are housed are piled one on top of another, the trays may not slip and the housed semiconductor devices 2 may not be overweighted. With the recessions 4 in the rear upward, semiconductor devices 6 of different external dimensions from the semiconductor devices 2 can be housed.