Title:
TREATING LIQUID COATING APPARATUS
Document Type and Number:
Japanese Patent JP3645586
Kind Code:
B2
Abstract:
PURPOSE: To decrease fluctuation of a gap between a nozzle and a base panel and to decrease fluctuation of a film thickness after a coating liq. is applied in a treating liq. coating apparatus.
CONSTITUTION: A resist liq. coating apparatus 1 is an apparatus for coating the surface of a square base panel W with a resist liq. and is provided with a base panel holding part, a nozzle 20, a gap sensor 27 and a gap adjusting mechanism 33. The base panel holding part has a holding panel 5 for holding the square base panel W. The nozzle 20 feeds a resist liq. on the surface of the base panel while it is relatively moved along the surface of the square base panel. The gap sensor 27 detects the gap between the relatively moving nozzle 20 and the surface of the square base panel W. The gap adjusting mechanism 33 adjusts the gap by moving the nozzle relatively close to or apart from the surface of the square base panel based on the detected result by means of the gap sensor 27.
Inventors:
Tsutomu Ueyama
Application Number:
JP12660794A
Publication Date:
May 11, 2005
Filing Date:
June 08, 1994
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
G03F7/16; B05C5/02; B05C11/08; H01L21/027; (IPC1-7): B05C11/08; B05C5/02; G03F7/16; H01L21/027
Domestic Patent References:
| JP58058174A | ||||
| JP5015819A | ||||
| JP3042068A | ||||
| JP62144780A |
Attorney, Agent or Firm:
Yukio Ono
Yoshio Miyagawa
Yoshio Miyagawa