Title:
超音波プローブ及びバッキング製造方法
Document Type and Number:
Japanese Patent JP7008593
Kind Code:
B2
Abstract:
The present invention is directed to improving an insulating property of a backing in which a lead array is buried. The method includes a coating forming process, in which insulating coatings are formed with respect to at least a plurality of lead rows included in a plurality of lead frames; after the forming of the insulating coatings, a plate manufacturing process, in which a plurality of backing plates are manufactured by pouring a backing material towards a lead row in each of the plurality of lead frames so that the lead row and the backing material are integrated with each other; and a laminating process, in which the plurality of backing plates are laminated.
Inventors:
Hidetsugu Katsura
Yoshihiro Tahara
Kazuhiro Kobayashi
Yoshihiro Tahara
Kazuhiro Kobayashi
Application Number:
JP2018155661A
Publication Date:
January 25, 2022
Filing Date:
August 22, 2018
Export Citation:
Assignee:
FUJIFILM Healthcare Co., Ltd.
International Classes:
H04R17/00; A61B8/14; H04R31/00
Domestic Patent References:
| JP201827235A | ||||
| JP865797A | ||||
| JP2015225898A |
Attorney, Agent or Firm:
Patent Corporation yki International Patent Office
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