Title:
VACUUM CHUCK FOR SEMICONDUCTOR WAFER AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH09321127
Kind Code:
A
Abstract:
To avoid producing dust from vent holes, rising the production cost and causing press marks of wafers at vacuum suction.
A ring 4 is disposed on the periphery of a chuck body 1, the body 2 and ring 4 are bolted to a chuck base 6 with ensuring suction gaps 5 between the body 1 and ring 4; the gaps being connected to suction holes 7 of the base 6. To hold a semiconductor wafer 8, the wafer is laid on a wafer holding face 2 having continuously formed grooves 3 and air is sucked through the holes 7 and exhausted through the holes 7 from the grooves 3 via the gaps 5 between the inner face of the ring 4 and body 1, thus holding the wafer at the face 2. This avoids producing dust from vent holes.
Inventors:
ABE KOZO
Application Number:
JP13031396A
Publication Date:
December 12, 1997
Filing Date:
May 24, 1996
Export Citation:
Assignee:
NIPPON STEEL CORP
International Classes:
B23Q3/08; B24B37/04; B24B37/30; H01L21/304; H01L21/68; H01L21/683; (IPC1-7): H01L21/68; B23Q3/08; B24B37/04; H01L21/304
Attorney, Agent or Firm:
矢葺 知之 （外１名）