To provide a wafer positioning device having improved accuracy in wafer positioning; and provide a wafer bonding device having the wafer positioning device.
A wafer positioning device 50 comprises: rotational position detection means 14 which is mounted on a rotary drive part 12 for rotating a wafer 11; mark position detection means 60 for measuring a position of a mark formed on the wafer; and a control device 21 for storing variation in a rotation angle of the rotational position detection means when the wafer is rotated by the rotary drive part as an approximate periodic function of positional variation of the mark. The control device calculate a correction amount of the rotation angle of the rotational position detection means from the approximate function to correct the rotation angle of the rotational position detection means based on the correction amount in wafer alignment. And a wafer bonding device having the wafer positioning device 50 is provided.
| JPS62237235 | CLEAN WARE STORAGE CASE |
| JP2022549214 | Self-aligned top via formation at line ends |
| JPH08306763A | 1996-11-22 | |||
| JP2004226064A | 2004-08-12 | |||
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| JP2006269915A | 2006-10-05 | |||
| JP5413529B2 | 2014-02-12 |
| WO2005067046A1 | 2005-07-21 |
Kenichi Aihara
Ryuji Ito
Junko Inoue