WAFER CARRIER FOR POWER DEVICE AND INSPECTION METHOD OF POWER DEVICE

Title:

WAFER CARRIER FOR POWER DEVICE AND INSPECTION METHOD OF POWER DEVICE

Document Type and Number:

Japanese Patent JP2012151370

Kind Code:

A

Abstract:

To provide a wafer carrier for power device which allows for inspection of a power device in the wafer state.

A wafer carrier 20 for power device is used while being sucked onto the mount 11 of a test device 10 when the electrical characteristics of a power device are tested at the wafer level, and holds a wafer W in which multiple power devices are formed. The wafer carrier 20 for power device comprises a carrier body 21, a conductive metal film 23 formed on the first principal surface of the carrier body 21 as a mounting surface of a wafer, a groove 20A for vacuum suction formed in the mounting surface, and a suction hole 20B communicating with a groove 11A for vacuum suction in the mounting surface 11 and opening in the groove 20A for vacuum suction.

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Inventors:

SHINOHARA EIICHI
TAOKA TAKESHI
OGASAWARA IKUO
SHINOZAKI MASARU

Application Number:

JP2011010272A

Publication Date:

August 09, 2012

Filing Date:

January 20, 2011

Export Citation:

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Assignee:

TOKYO ELECTRON LTD

International Classes:

H01L21/66; H01L21/683

Domestic Patent References:

JP2001135685A	2001-05-18
JP2001326270A	2001-11-22
JP2010098056A	2010-04-30

Attorney, Agent or Firm:

Hajime Ohara

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