Title:
ウェーハの加工方法
Document Type and Number:
Japanese Patent JP7341607
Kind Code:
B2
Abstract:
A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of blowing air to each device chip from the polyester sheet side to push up each device chip through the polyester sheet and picking up each device chip from the polyester sheet.
Inventors:
Shigenori Harada
Minoru Matsuzawa
Itsuto Kiuchi
Yoshiaki Yodo
Taro Arakawa
Masamitsu Kamisato
Keimiko Kawamura
Yusuke Fujii
Toshiki Miyai
Omae scroll
Minoru Matsuzawa
Itsuto Kiuchi
Yoshiaki Yodo
Taro Arakawa
Masamitsu Kamisato
Keimiko Kawamura
Yusuke Fujii
Toshiki Miyai
Omae scroll
Application Number:
JP2019165419A
Publication Date:
September 11, 2023
Filing Date:
September 11, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; B23K26/53
Domestic Patent References:
| JP2017152569A | ||||
| JP2014221483A | ||||
| JP2011014778A | ||||
| JP6037169A | ||||
| JP2003188195A | ||||
| JP2013055137A | ||||
| JP2019110198A | ||||
| JP2012119670A | ||||
| JP2007165636A | ||||
| JP2005191297A |
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano