To improve the assembly yield of a high frequency module by reducing the reflection of high frequency signals in a connection portion of a high frequency component.

A waveguide member 10 is composed of: a quadrangular column-like dielectric 11 where a groove 12 is formed on one side surface from its one end to the other end; a conductor layer 13 deposited on the inner surface of the groove 12; and an end face conductor layer 14 deposited at an opening edge of the groove 12 on one end face of the dielectric 11 and continuing to the conductor 13. One side surface of the waveguide member is brazed to close the groove 12 on a wiring pattern 9 of a wiring board 8 where the wiring pattern 9 is formed on its principal surface, thereby configuring the waveguide.