WIRING BOARD AND ITS PRODUCTION

Title:

WIRING BOARD AND ITS PRODUCTION

Document Type and Number:

Japanese Patent JPH09113932

Kind Code:

A

Abstract:

To improve the productivity of a wiring board laminated and formed with wirings via insulating layers by lithography method by divided exposure.

This board is formed with plural pieces of the wirings 4, the first insulating layer covering the wirings 4, terminals 7 connected to the wirings 4, the plural wirings 5 on the first insulating layer, the second insulating layer covering the wirings 5 and terminals 8 connected to the wirings 5 respectively by at least the lithography method of the divided exposure. In such a case, the terminals 7 and 8 are formed of the same conductive films. The wirings 4 and the terminals 7 are connected via the contact holes formed in the first insulating layer. The wirings 5 and the terminals 8 are connected via the contact holes formed in the second insulating layer. The terminals 7 and 8 and pixel electrodes 6 of the TFT substrate for a liquid crystal display panel are formed of the same conductive films.

Inventors:

FUJIKAWA TETSUYA
INOUE ATSUSHI
HIROTA SHIRO
SUGINE MITSUAKI

Application Number:

JP27133095A

Publication Date:

May 02, 1997

Filing Date:

October 19, 1995

Export Citation:

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Assignee:

FUJITSU LTD

International Classes:

G02F1/1345; G02F1/136; G02F1/1368; H01L21/336; H01L29/786; (IPC1-7): G02F1/136; G02F1/1345; H01L21/336; H01L29/786

Attorney, Agent or Firm:

Teiichi

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