Title:
WIRING BOARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH04354398
Kind Code:
A
Abstract:
PURPOSE: To form pads having a prescribed area with prescribed positional relation by allowing positional deviations generated on apertures formed on an insulating film. CONSTITUTION: Apertures 15 are formed on an insulating film 14 covering wirings formed on a substrate 11 and pad constitution parts 13 are exposed to constitute pads. In this case, each pad constitution part 13 has an excess dimension 21 exceeding the dimension L of each pad and each aperture 15 has an excess dimension 2d exceeding the width of each pad constitution part 3 and is formed so as to cross the pad constitution part 13.
Inventors:
SHIRAI MASAHARU
YAMANAKA KIMIHIRO
YAMANAKA KIMIHIRO
Application Number:
JP15612391A
Publication Date:
December 08, 1992
Filing Date:
May 31, 1991
Export Citation:
Assignee:
IBM
International Classes:
H01L21/48; H01L23/538; H05K3/34; H05K1/11; (IPC1-7): H05K3/34
Domestic Patent References:
| JP59146967B | ||||
| JPS5761862B2 | 1982-12-27 | |||
| JPS5680196A | 1981-07-01 |
Attorney, Agent or Firm:
Kiyoshi Goda (2 outside)