To prevent a conductor pattern disposed immediately above a gap between an insulation substrate and a capacitor in a cavity from breaking and improve the reliability of electric connection in a wiring board.
A wiring board 10 has: a substrate 100 (insulation substrate) in which a cavity R10 is formed; an electronic component 200 (electronic device) disposed in the cavity R10; an insulation layer 101 (interlayer insulating layer) disposed on the substrate 100 and the electronic component 200; and a conductor layer 110 disposed on the insulation layer 101. In the wiring board 10, a gap between the substrate 100 and the electronic component 200 in the cavity R10 is filled with an insulation material (insulator 101a) forming the insulation layer 101. The conductor layer 110 has a conductor pattern partially widened in an area immediately above the gap (immediately above region R1).
SAKAI SHUNSUKE
YOSHIKAWA KAZUHIRO
