Title:
配線基板及び配線基板の製造方法
Document Type and Number:
Japanese Patent JP6582155
Kind Code:
B2
Abstract:
This wiring board comprises: a substrate having a first elastic modulus and including a first surface and a second surface positioned on the opposite side of the first surface; wiring positioned on the first surface side of the substrate and connected to an electrode of an electronic component mounted on the wiring board; and a reinforcing member having a second elastic modulus greater than the first elastic modulus and at least including a first reinforcing part that is positioned on the first surface side of the substrate or on the second surface side of the substrate and that at least partially overlaps the electronic component mounted on the wiring board when viewed along the normal direction of the first surface of the substrate. The wiring includes a section that does not overlap the reinforcing member when viewed along the normal direction of the first surface and that has a meandering shape section including pluralities of peaks and valleys aligned along an planar direction of the first surface of the substrate.
Inventors:
Kenichi Ogawa
Takao Someya
Takao Someya
Application Number:
JP2019519357A
Publication Date:
September 25, 2019
Filing Date:
October 12, 2018
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
National University Corporation Tokyo University
National University Corporation Tokyo University
International Classes:
H05K1/02; H01B5/14; H01B7/06; H01B13/00; H01B13/008; H05K1/03; H05K3/00
Domestic Patent References:
| JP2016509375A | ||||
| JP2012204170A |
Foreign References:
| US20140299362 | ||||
| US20120052268 | ||||
| KR1020140058239A | ||||
| US20140218872 | ||||
| KR1020090092982A | ||||
| US20040238819 | ||||
| US20110123724 | ||||
| US20150348800 |
Attorney, Agent or Firm:
Hiroyuki Nagai
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Yukihiro Hotta
Kazuo Okamura
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Yukihiro Hotta
Kazuo Okamura