Title:
配線基板および素子付配線基板
Document Type and Number:
Japanese Patent JP7342404
Kind Code:
B2
Abstract:
To provide a wiring board capable of reducing variation in the height of connections.SOLUTION: A wiring board comprises a support substrate 1, a wiring layer 3 formed on one surface side of the support substrate 1, and having multiple wiring including pad parts PA1, PA2, PB1, PB2, PA3, and a cover insulation layer 4 covering the wiring layer and having openings X above the pads, and has component mounting regions M for mounting the components. The wiring has at least the inner pad parts PA1, PB2, as pad parts, in the component mounting regions M, the area of the inner pad parts exposed by the openings X is 2.0×10-3 mm2 or less, and the wiring layer has wiring A and wiring B. The wiring A has an adjustment pad part PA3 for adjusting the total area of exposed parts exposed by the openings X. The area Sα of the adjustment pad part satisfies a relationship that SB/(SA-Sα) goes above 103, where SA is total area in the wiring A, and SB is total area in the wiring B.SELECTED DRAWING: Figure 3
More Like This:
Inventors:
Yuji Narita
Atsuko Chiyoshi
Atsuko Chiyoshi
Application Number:
JP2019068234A
Publication Date:
September 12, 2023
Filing Date:
March 29, 2019
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H01L23/12; H01L21/60
Foreign References:
| WO2012073417A1 |
Attorney, Agent or Firm:
Akihiko Yamashita
Tatsuto Kishimoto
Tatsuto Kishimoto