Title:
WIRING BOARD WITH UNCURED ADHESIVE LAYER AND PROCESS OF MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2014067789
Kind Code:
A
Abstract:
To provide a wiring board on a surface of which an uncured adhesive layer with a high degree of freedom in composition design is efficiently and easily formed without a void.
The process of manufacturing a wiring board with an uncured adhesive layer includes forming the uncured adhesive layer by applying an epoxy adhesive liquid that contains an organic solvent and whose viscosity at temperature of 23°C and at pressure of 105 N/m2 is 0.01 to 3 Pa s to a mounting surface of the wiring board, and then drying and removing the organic solvent.
More Like This:
| JPS63186566 | COCKCROFT CIRCUIT SUBSTRATE |
| JP2006167991 | SCREEN PRINTING DEVICE AND ITS PRINTING METHOD |
Inventors:
NONAKA TOSHINAKA
MATSUMURA KAZUYUKI
MATSUMURA KAZUYUKI
Application Number:
JP2012210690A
Publication Date:
April 17, 2014
Filing Date:
September 25, 2012
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
H05K3/34; C08L63/00; C08L79/08; C09J11/06; C09J163/00; C09J179/08; H01L21/60
Previous Patent: MANUFACTURING METHOD OF CIRCUIT-COMPONENT BUILT-IN BOARD
Next Patent: SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Next Patent: SEMICONDUCTOR DEVICE MANUFACTURING METHOD