Title:
WIRING BOARD
Document Type and Number:
Japanese Patent JP2007048802
Kind Code:
A
Abstract:
To provide a BGA wiring board wherein a difference (variance in bump height) in bump height of a matrix bump in a BGA wiring board can be reduced, and which can be mounted in high reliability to other boards.
The BGA (Ball Grid Array) is provided with a bump that is manufactured by electric plating. The diameter of the bump around the BGA is made so as to be 130% or more and 500% or less of that at the center of the BGA.
Inventors:
SHINOURA OSAMU
MATSUSE MITSUTAKA
MATSUSE MITSUTAKA
Application Number:
JP2005229133A
Publication Date:
February 22, 2007
Filing Date:
August 08, 2005
Export Citation:
Assignee:
TDK CORP
International Classes:
H01L21/60; H01L23/12
Domestic Patent References:
| JPS636860A | 1988-01-12 | |||
| JPH09139387A | 1997-05-27 | |||
| JP2001210749A | 2001-08-03 | |||
| JPH05218042A | 1993-08-27 | |||
| JPH1050773A | 1998-02-20 | |||
| JPH09275123A | 1997-10-21 |
Attorney, Agent or Firm:
Hideo Sarada
Junzo Yoneda
Junzo Yoneda
Previous Patent: MOUNTING STRUCTURAL BODY, ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS
Next Patent: ELECTRON BEAM EQUIPMENT
Next Patent: ELECTRON BEAM EQUIPMENT